ZeqThermal

Chip thermal simulation with R(t)-modulated heat dissipation. Junction temperature prediction, hotspot identification, cooling solution sizing.

Endpoint	POST /api/hardware/thermal
Auth	api-key
Rate limit	10/min
Category	hardware

Parameters

Name	Type	Required	Description
chipLayout	object	Yes	Die layout with power density map.
coolingType	string	No	'passive', 'active-air', 'liquid', 'immersion'.
ambientTemp_C	number	No	Ambient temperature.

Returns

{ junctionTemp_C, hotspots, thermalResistance_C_W, coolingRequired_W, zeqond }

Example

curl -sS -X POST \
  -H "Authorization: Bearer zsm_..." \
  -H "Content-Type: application/json" \
  -d '{
  "chipLayout": {},
  "coolingType": "active-air",
  "ambientTemp_C": 25
}' \
  "https://zeqsdk.com/api/hardware/thermal"

This protocol is a named building block — one of the operations you compose inside a state contract. Call it directly with the request above, or invoke it from a contract that fires on your machine's clock. Browse the whole library at GET /api/protocols; fetch this one at GET /api/protocols/zeq-thermal.